Infrared soldering automatic furnace 180x235mm

Description

• This reflow soldering iron has a large maximum infrared soldering area, which effectively reaches: 180 x 235 mm. The accuracy of the thermal cycle is maintained by microcomputer by closed-loop control using infrared radiators, thermocouples and forced air flow. This machine can solder most small parts of the circuit board, such as B. CHIP, SOP, PLCC, QFP, BGA etc.
  • Fast infrared radiation
  • Wide range of soldering
  • smoke hole
  • LCD screen

   Infrared radiation with air circulation ensures a very precise, even distribution of heat.

  The parameters of eight (8) soldering cycles are predefined.

  Heat cycle accuracy is maintained by microcomputer control with infrared, thermocouple and forced air flow.

  A wide working area of 300mm x 320mm, which allows you to work in a variety of working conditions, makes it an all-in-one device

  An efficient cooling system with a vent is designed to ensure rapid cooling of the product and ensures the reduction of temperature required when releasing the printed circuit board.

  Complete visual control via a high-quality LCD screen.

  The keyboard selects soldering cycles and displays the progress.

  Automatic microcomputer control. The whole soldering process can be completed automatically by preheating, soaking and remelting by cooling.

  The oven can be used for glue solidification, thermal aging of the printed circuit board, maintenance of printed circuit boards, etc.; It can also solder single and double board with all kinds of package such as CHIP, SOP, PLCC, QFP, BGA, etc.

  specifications

  • Infrared reflow oven model: T-962
  • Rated power: 800W
  • Effective soldering Max. area: 180 x 235 mm (7.1 x 9.25 inch)
  • Power supply: AC 220V / 50Hz
  • Temperature range: 0 °C -280 °C
  • Cycle time: 1~8min
  • Rated duty cycle: 100%
  • Display language: English

   

  Manual Infrared soldering automatic furnace

• INFRARED IC HEATER T-962 User Manual